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1. general description the nx3l1t53 is a low-ohmic single-pole double-throw analog switch suitable for use as an analog or digital 2:1 multip lexer/demultiplexer. it has a digital select input (s), two independent inputs/outputs (y0 and y1), a common input/output (z) and an active low enable input (e ). when pin e is high, the switch is turned off. schmitt trigger action at the digital inputs makes the circuit tolerant to slower input rise and fall times. low threshold digital inputs allows th is device to be driven by 1.8 v logic levels in 3.3 v applications without signific ant increase in supply current i cc . this makes it possible for the nx3l1t53 to switch 4.3 v signals with a 1.8 v digital controller, eliminating the need for logi c level translation. the nx 3l1t53 allows signals with amplitude up to v cc to be transmitted from z to y0 or y1 ; or from y0 or y1 to z. it?s low on resistance (0.5 ? ) and flatness (0.13 ? ) ensures minimal attenuation and distortion of transmitted signals. 2. features and benefits ? wide supply voltage range from 1.4 v to 4.3 v ? very low on resistance (peak): ? 1.6 ? (typical) at v cc =1.4v ? 1.0 ? (typical) at v cc =1.65v ? 0.55 ? (typical) at v cc =2.3v ? 0.50 ? (typical) at v cc =2.7v ? 0.50 ? (typical) at v cc =4.3v ? break-before-make switching ? high noise immunity ? esd protection: ? hbm jesd22-a114f class 3a exceeds 7500 v ? mm jesd22-a115-a exceeds 200 v ? cdm aec-q100-011 revision b exceeds 1000 v ? iec61000-4-2 contact discharge exceeds 8000 v for switch ports ? cmos low-power consumption ? latch-up performance exceeds 100 ma per jesd 78 class ii level a ? 1.8 v control logic at v cc = 3.6 v ? control input accepts volt ages above supply voltage ? very low supply current, even when input is below v cc ? high current handling capabilit y (350 ma continuous cu rrent under 3.3 v supply) ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c nx3l1t53 low-ohmic single-pole d ouble-throw analog switch rev. 5 ? 1 august 2011 product data sheet
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 2 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 3. applications ? cell phone ? pda ? portable media player 4. ordering information 5. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. table 1. ordering information type number package temperature range name description version nx3l1t53gt ? 40 ? cto+125 ? c xson8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 ? 1.95 ? 0.5 mm sot833-1 nx3l1t53gd ? 40 ? cto+125 ? c xson8u plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 ? 2 ? 0.5 mm sot996-2 NX3L1T53GM ? 40 ? c to +125 ? c xqfn8u plastic extremely thin quad flat package; no leads; 8 terminals; utlp based; body 1.6 ? 1.6 ? 0.5 mm sot902-1 table 2. marking codes [1] type number marking code nx3l1t53gt m53 nx3l1t53gd m53 NX3L1T53GM m53
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 3 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 6. functional diagram 7. pinning information 7.1 pinning fig 1. logic symbol 001aad386 s z e y0 y16 7 2 5 1 fig 2. logic diagram 001aad387 z y0 s y1 e fig 3. pin configuration sot833-1 (xson8) fig 4. pin configuration sot996-2 (xson8u) nx3l1t53 y1 y0 v cc s gnd e z gnd 001aaj537 36 27 18 45 transparent top view 001aaj955 nx3l1t53 transparent top view 8 7 6 5 1 2 3 4 z e gnd gnd v cc y0 y1 s
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 4 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 7.2 pin description 8. functional description [1] h = high voltage level; l = low voltage level; x = don?t care. fig 5. pin configuration sot902-1 (xqfn8u) 001aaj538 e y1 z v cc gnd y0 gnd s transparent top view 3 6 4 1 5 8 7 2 terminal 1 index area nx3l1t53 table 3. pin description symbol pin description sot833-1 and sot996-2 sot902-1 z 1 7 common output or input e 2 6 enable input (active low) gnd 3 5 ground (0 v) gnd 4 4 ground (0 v) s 5 3 select input y1 6 2 independent input or output y0 7 1 independent input or output v cc 8 8 supply voltage table 4. function table [1] input channel on s e l l y0 to z or z to y0 h l y1 to z or z to y1 x h switch off
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 5 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 9. limiting values [1] the minimum input voltage rating may be exceeded if the input current rating is observed. [2] the minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 v. [3] for xson8, xson8u and xqfn8u packages: above 118 ? c the value of p tot derates linearly with 7.8 mw/k. 10. recommended operating conditions [1] to avoid sinking gnd current from termi nal z when switch current flows in terminal yn, the voltage drop across the bidirecti onal switch must not exceed 0.4 v. if the switch current flows into terminal z, no gnd current will flow from terminal yn. in this case, ther e is no limit for the voltage drop across the switch. [2] applies to control signal levels. table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +4.6 v v i input voltage select input s and enable input e [1] ? 0.5 +4.6 v v sw switch voltage [2] ? 0.5 v cc + 0.5 v i ik input clamping current v i < ? 0.5 v ? 50 - ma i sk switch clamping current v i < ? 0.5 v or v i >v cc + 0.5 v - ? 50 ma i sw switch current v sw > ? 0.5 v or v sw < v cc + 0.5 v; source or sink current - ? 350 ma v sw > ? 0.5 v or v sw < v cc + 0.5 v; pulsed at 1 ms duration, < 10 % duty cycle; peak current - ? 500 ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? cto+125 ?c [3] - 250 mw table 6. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 1.4 - 4.3 v v i input voltage select input s and enable input e 0- 4.3v v sw switch voltage [1] 0- v cc v t amb ambient temperature ? 40 - +125 ?c ? t/ ? v input transition rise and fall rate v cc = 1.4 v to 4.3 v [2] - - 200 ns/v
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 6 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 11. static characteristics table 7. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground 0 v). symbol parameter conditions t amb = 25 ?c t amb = ? 40 ? c to +125 ?c unit min typ max min max (85 ?c) max (125 ?c) v ih high-level input voltage v cc = 1.4 v to 1.6 v 0.9 - - 0.9 - - v v cc = 1.65 v to 1.95 v 0.9 - - 0.9 - - v v cc = 2.3 v to 2.7 v 1.1 - - 1.1 - - v v cc = 2.7 v to 3.6 v 1.3 - - 1.3 - - v v cc = 3.6 v to 4.3 v 1.4 - - 1.4 - - v v il low-level input voltage v cc = 1.4 v to 1.6 v - - 0.3 - 0.3 0.3 v v cc = 1.65 v to 1.95 v - - 0.4 - 0.4 0.3 v v cc = 2.3 v to 2.7 v - - 0.4 - 0.4 0.4 v v cc = 2.7 v to 3.6 v - - 0.5 - 0.5 0.5 v v cc = 3.6 v to 4.3 v - - 0.6 - 0.6 0.6 v i i input leakage current select input s and enable input e ; v i = gnd to 4.3 v; v cc = 1.4 v to 4.3 v --- - ? 0.5 ? 1 ? a i s(off) off-state leakage current y0 and y1 port; see figure 6 v cc = 1.4 v to 3.6 v - - ? 5- ? 50 ? 500 na v cc = 3.6 v to 4.3 v - - ? 10 - ? 50 ? 500 na i s(on) on-state leakage current z port; see figure 7 v cc = 1.4 v to 3.6 v - - ? 5- ? 50 ? 500 na v cc = 3.6 v to 4.3 v - - ? 10 - ? 50 ? 500 na i cc supply current v i =v cc or gnd; v sw =gndorv cc v cc = 3.6 v - - 100 - 690 6000 na v cc = 4.3 v - - 150 - 800 7000 na ? i cc additional supply current v sw =gndorv cc v i = 2.6 v; v cc =4.3v - 2.0 4.0 - 7 7 ? a v i = 2.6 v; v cc = 3.6 v - 0.35 0.7 - 1 1 ? a v i = 1.8 v; v cc = 4.3 v - 7.0 10.0 - 15 15 ? a v i = 1.8 v; v cc =3.6v - 2.5 4.0 - 5 5 ? a v i = 1.8 v; v cc = 2.5 v - 50 200 - 300 500 na c i input capacitance -1.0----pf c s(off) off-state capacitance -35----pf c s(on) on-state capacitance -130----pf
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 7 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 11.1 test circuits 11.2 on resistance v i =0.3vorv cc ? 0.3 v; v o =v cc ? 0.3 v or 0.3 v. fig 6. test circuit for measuring off-state leakage current v o i s 001aad390 s z e y0 y1 v cc gnd switch switch 1 1 2 2 v ih v il s v ih v ih e v i v il or v ih v ih v i =0.3vorv cc ? 0.3 v; v o = open circuit. fig 7. test circuit for measuring on-state leakage current i s 001aad391 s z e y0 y1 v cc gnd v i v il or v ih v il switch 1 2v ih v il s v il v il e v o switch 1 2 table 8. on resistance at recommended operating conditions; voltages are referenced to gnd (ground = 0 v); for graphs see figure 9 to figure 15 . symbol parameter conditions ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max r on(peak) on resistance (peak) v i =gndtov cc ; i sw = 100 ma; see figure 8 v cc = 1.4 v - 1.6 3.7 - 4.1 ? v cc = 1.65 v - 1.0 1.6 - 1.7 ? v cc = 2.3 v - 0.55 0.8 - 0.9 ? v cc =2.7v - 0.5 0.75 - 0.9 ? v cc =4.3v - 0.5 0.75 - 0.9 ?
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 8 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch [1] typical values are measured at t amb = 25 ? c. [2] measured at identical v cc , temperature and input voltage. [3] flatness is defined as the difference between the maximum and minimum value of on resistance measured at identical v cc and temperature. 11.3 on resistance test circuit and waveforms ? r on on resistance mismatch between channels v i =gndtov cc ; i sw = 100 ma [2] v cc = 1.4 v - 0.04 0.3 - 0.3 ? v cc = 1.65 v - 0.04 0.2 - 0.3 ? v cc = 2.3 v - 0.02 0.08 - 0.1 ? v cc = 2.7 v - 0.02 0.075 - 0.1 ? v cc = 4.3 v - 0.02 0.075 - 0.1 ? r on(flat) on resistance (flatness) v i =gndtov cc ; i sw = 100 ma [3] v cc = 1.4 v - 1.0 3.3 - 3.6 ? v cc = 1.65 v - 0.5 1.2 - 1.3 ? v cc = 2.3 v - 0.15 0.3 - 0.35 ? v cc = 2.7 v - 0.13 0.3 - 0.35 ? v cc = 4.3 v - 0.2 0.4 - 0.45 ? table 8. on resistance ?continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v); for graphs see figure 9 to figure 15 . symbol parameter conditions ? 40 ? c to +85 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max r on = v sw / i sw . fig 8. test circuit for measuring on resistance s e z y0 v il or v ih v cc v il switch 1 2v ih v il s v il v il e v i v 001aah456 y1 v sw switch gnd 1 2 i sw
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 9 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch (1) v cc =1.5v. (2) v cc =1.8v. (3) v cc =2.5v. (4) v cc =2.7v. (5) v cc =3.3v. (6) v cc =4.3v. measured at t amb =25 ? c. fig 9. on resistance as a function of input voltage v i (v) 05 4 3 12 001aag564 0.8 0.4 1.2 1.6 r on () 0 (1) (2) (5) (6) (4) (3) (1) t amb = 125 ? c. (2) t amb =85 ? c. (3) t amb =25 ? c. (4) t amb = ?40 ? c. (1) t amb = 125 ? c. (2) t amb =85 ? c. (3) t amb =25 ? c. (4) t amb = ?40 ? c. fig 10. on resistance as a function of input voltage; v cc =1.5v fig 11. on resistance as a function of input voltage; v cc =1.8v 001aag565 v i (v) 03 2 1 0.8 0.4 1.2 1.6 r on () 0 (1) (2) (3) (4) 001aag566 v i (v) 03 2 1 0.4 0.6 0.2 0.8 1.0 r on () 0 (1) (2) (3) (4)
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 10 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch (1) t amb = 125 ? c. (2) t amb =85 ? c. (3) t amb =25 ? c. (4) t amb = ?40 ? c. (1) t amb = 125 ? c. (2) t amb =85 ? c. (3) t amb =25 ? c. (4) t amb = ?40 ? c. fig 12. on resistance as a function of input voltage; v cc =2.5v fig 13. on resistance as a function of input voltage; v cc =2.7v 001aag567 v i (v) 03 2 1 0.4 0.6 0.2 0.8 1.0 r on () 0 (1) (2) (3) (4) 001aag568 v i (v) 03 2 1 0.4 0.6 0.2 0.8 1.0 r on () 0 (1) (2) (3) (4) (1) t amb = 125 ? c. (2) t amb =85 ? c. (3) t amb =25 ? c. (4) t amb = ?40 ? c. (1) t amb = 125 ? c. (2) t amb =85 ? c. (3) t amb =25 ? c. (4) t amb = ?40 ? c. fig 14. on resistance as a function of input voltage; v cc =3.3v fig 15. on resistance as a function of input voltage; v cc =4.3v v i (v) 04 3 12 001aag569 0.4 0.6 0.2 0.8 1.0 r on () 0 (1) (2) (3) (4) v i (v) 05 4 23 1 001aaj896 0.4 0.6 0.2 0.8 1.0 r on () 0 (1) (2) (3) (4)
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 11 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 12. dynamic characteristics [1] typical values are measured at t amb = 25 ? c and v cc = 1.5 v, 1.8 v, 2.5 v, 3.3 v and 4.3 v respectively. [2] break-before-make guaranteed by design. table 9. dynamic characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v); for load circuit see figure 18 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max (85 ?c) max (125 ?c) t en enable time s or e to z or yn; see figure 16 v cc = 1.4 v to 1.6 v - 50 90 - 120 120 ns v cc = 1.65 v to 1.95 v - 36 70 - 80 90 ns v cc = 2.3 v to 2.7 v - 24 45 - 50 55 ns v cc = 2.7 v to 3.6 v - 22 40 - 45 50 ns v cc = 3.6 v to 4.3 v - 22 40 - 45 50 ns t dis disable time s or e to z or yn; see figure 16 v cc = 1.4 v to 1.6 v - 32 70 - 80 90 ns v cc = 1.65 v to 1.95 v - 20 55 - 60 65 ns v cc = 2.3 v to 2.7 v - 12 25 - 30 35 ns v cc = 2.7 v to 3.6 v - 10 20 - 25 30 ns v cc = 3.6 v to 4.3 v - 10 20 - 25 30 ns t b-m break-before-make time see figure 17 [2] v cc = 1.4 v to 1.6 v - 19 - 9 - - ns v cc = 1.65 v to 1.95 v - 17 - 7 - - ns v cc = 2.3 v to 2.7 v - 13 - 4 - - ns v cc = 2.7 v to 3.6 v - 10 - 3 - - ns v cc = 3.6 v to 4.3 v - 10 - 2 - - ns
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 12 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 12.1 waveform and test circuits measurement points are given in table 10 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 16. enable and disable times 001aah457 t en t dis t dis v x v x v x v x output off to high high to off output high to off off to high s, e input v i v oh v m v m gnd v oh gnd gnd t en table 10. measurement points supply voltage input output v cc v m v x 1.4 v to 4.3 v 0.5v cc 0.9v oh
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 13 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch a. test circuit b. input and output measurement points fig 17. test circuit for measuri ng break-before-make timing 001aah458 r l s gnd e z y0 v il y1 v cc v i c l g v v o v ext = 1.5 v 001aag572 v i t b-m v o 0.9v o 0.9v o 0.5v i test data is given in table 11 . definitions test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. v ext = external voltage for measuring switching times. v i may be connected to s or e . fig 18. test circuit for measuring switching times 001aah459 r l s gnd e z y0 v il y1 v cc v i c l g v v o v ext = 1.5 v switch 1 2
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 14 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 12.2 additional dynami c characteristics [1] f i is biased at 0.5v cc . table 11. test data supply voltage input load v cc v i t r , t f c l r l 1.4 v to 4.3 v v cc ? 2.5ns 35pf 50 ? table 12. additional dynamic characteristics at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v); v i = gnd or v cc (unless otherwise specified); t r = t f ? 2.5 ns; t amb = 25 ? c. symbol parameter conditions min typ max unit thd total harmonic distortion f i =20hzto20 khz; r l =32 ? ; see figure 19 [1] v cc =1.4v; v i = 1 v (p-p) - 0.15 - % v cc =1.65v; v i = 1.2 v (p-p) - 0.10 - % v cc =2.3v; v i = 1.5 v (p-p) - 0.02 - % v cc =2.7v; v i = 2 v (p-p) - 0.02 - % v cc =4.3v; v i = 2 v (p-p) - 0.02 - % f ( ? 3db) ? 3 db frequency response r l =50 ? ; see figure 20 [1] v cc = 1.4 v to 4.3 v - 60 - mhz ? iso isolation (off-state) f i = 100 khz; r l =50 ? ; see figure 21 [1] v cc = 1.4 v to 4.3 v - ? 90 - db v ct crosstalk voltage between digital inputs and switch; f i = 1 mhz; c l = 50 pf; r l =50 ? ; see figure 22 v cc = 1.4 v to 3.6 v - 0.2 - v v cc = 3.6 v to 4.3 v - 0.3 - v xtalk crosstalk between switches; f i = 100 khz; r l =50 ? ;see figure 23 [1] v cc = 1.4 v to 4.3 v - ? 90 - db q inj charge injection f i = 1 mhz; c l = 0.1 nf; r l =1 m ? ; v gen =0v; r gen =0 ? ; see figure 24 v cc = 1.5 v - 3 - pc v cc = 1.8 v - 4 - pc v cc =2.5v - 6 - pc v cc =3.3v - 9 - pc v cc =4.3v - 15 - pc
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 15 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 12.3 test circuits fig 19. test circuit for measuri ng total harmonic distortion s e z y0 v il or v ih v cc 0.5v cc v il switch 1 2v ih v il s v il v il e f i d 001aah460 y1 switch gnd 1 2 r l adjust f i voltage to obtain 0 dbm level at output. increase f i frequency until db meter reads ? 3db. fig 20. test circuit for measuring the frequency response when switch is in on-state s e z y0 v il or v ih v cc 0.5v cc v il switch 1 2v ih v il s v il v il e f i db 001aah461 y1 switch gnd 1 2 r l adjust f i voltage to obtain 0 dbm level at input. fig 21. test circuit for measuring isolation (off-state) s e z y0 v il or v ih v cc 0.5v cc v ih switch 1 2v il v ih s v ih v ih e f i db 001aah462 y1 switch gnd 1 2 r l 0.5v cc r l
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 16 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch a. test circuit b. input and output pulse definitions v i may be connected to s or e . fig 22. test circuit for measuring crosstalk voltage between digital inputs and switch v 001aah452 r l s e z y0 v il or v ih y1 v cc v i v o logic input 0.5v cc r l c l 0.5v cc g v ct on off logic input (s, e) off v o 001aah453 fig 23. test circuit for measuring crosstalk s e z y0 v il or v ih v cc 0.5v cc v ih db 001aah463 y1 gnd 1 2 r l f i 0.5v cc r l
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 17 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch a. test circuit b. input and output pulse definitions q inj = ? v o ? c l . ? v o = output voltage variation. r gen = generator resistance. v gen = generator voltage. v i may be connected to s or e . fig 24. test circuit for measuring charge injection 001aad398 s z y0 y1 r l c l v cc gnd r gen v gen switch 1 2 v i v o e v il g 001aah451 v o off off on v o logic input (s, e)
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 18 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 13. package outline fig 25. package outline sot833-1 (xson8) terminal 1 index area references outline version european projection issue date iec jedec jeita sot833-1 - - - mo-252 - - - sot833-1 07-11-14 07-12-07 dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 2.0 1.9 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.50.6 a (1) max 0.5 0.04 1 8 2 7 3 6 4 5 8 (2) 4 (2) a
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 19 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch fig 26. package outline sot996-2 (xson8u) references outline version european projection issue date iec jedec jeita sot996-2 - - - - - - sot996-2 07-12-18 07-12-21 unit a max mm 0.5 0.05 0.00 0.35 0.15 3.1 2.9 0.5 1.5 0.5 0.3 0.6 0.4 0.1 0.05 a 1 dimensions (mm are the original dimensions) xson8u: plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 x 2 x 0.5 mm 0 1 2 mm scale b d 2.1 1.9 e e e 1 l l 1 0.15 0.05 l 2 v w 0.05 y y 1 0.1 c y c y 1 x b 14 85 e 1 e ac b v m c w m l 2 l 1 l terminal 1 index area b a d e detail x a a 1
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 20 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch fig 27. package outline sot902-1 (xqfn8u) references outline version european projection issue date iec jedec jeita sot902-1 mo-255 - - - - - - sot902-1 05-11-25 07-11-14 unit a max mm 0.5 a 1 0.25 0.15 0.05 0.00 1.65 1.55 0.35 0.25 0.15 0.05 dimensions (mm are the original dimensions) xqfn8u: plastic extremely thin quad flat package; no leads; 8 terminals; utlp based; body 1.6 x 1.6 x 0.5 mm b dl e 1 1.65 1.55 ee l 1 v 0.1 0.55 0.5 w 0.05 y 0.05 0.05 y 1 0 1 2 mm scale x c y c y 1 terminal 1 index area terminal 1 index area b a d e detail x a a 1 b 8 7 6 5 e 1 e 1 e e ac b ? v m c ? w m 4 1 2 3 l l 1 metal area not for soldering
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 21 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 14. abbreviations 15. revision history table 13. abbreviations acronym description cdm charged device model cmos complementary metal-oxide semiconductor esd electrostatic discharge hbm human body model mm machine model table 14. revision history document id release date data sheet status change notice supersedes nx3l1t53 v.5 20110801 product data sheet - nx3l1t53 v.4 modifications: ? general description updated (errrata). nx3l1t53 v.4 20100324 product data sheet - nx3l1t53 v.3 nx3l1t53 v.3 20100201 product data sheet - nx3l1t53 v.2 nx3l1t53 v.2 20090414 product data sheet - nx3l1t53 v.1 nx3l1t53 v.1 20090217 product data sheet - -
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 22 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
nx3l1t53 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 5 ? 1 august 2011 23 of 24 nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors nx3l1t53 low-ohmic single-pole double-throw analog switch ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 1 august 2011 document identifier: nx3l1t53 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 4 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 recommended operating conditions. . . . . . . . 5 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 11.1 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.2 on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.3 on resistance test circuit and waveforms . . . . 8 12 dynamic characteristics . . . . . . . . . . . . . . . . . 11 12.1 waveform and test circuits . . . . . . . . . . . . . . . 12 12.2 additional dynamic characteristics . . . . . . . . . 14 12.3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 22 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17 contact information. . . . . . . . . . . . . . . . . . . . . 23 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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